PCB Design Engineer - Signal Integrity/Thermal Simulation

About Turing:
Based in San Francisco, California, Turing is the world’s leading research accelerator for frontier AI labs and a trusted partner for global enterprises deploying advanced AI systems.

Role Overview

We are seeking a senior Hardware Design Engineer with 8+ years of experience designing, redesigning, simulating, and validating electronic hardware. The role focuses on KiCad-based PCB design and simulation-led redesign, with specialization in Signal Integrity (SI)/Electromagnetic Compatibility (EMC), thermal simulation, or both.

Experience: 

4+ years in the relevant simulation specialization and 6+ years of hands-on electronics hardware and PCB design experience

Key Responsibilities

• Translate product requirements into circuit architectures, hardware specifications, and validated designs across digital, high-speed, power, analog, mixed-signal, sensor, communication, or RF applications.
• Use KiCad for schematic capture, component selection, multilayer PCB layout, routing, design-rule checks, BOM preparation, and manufacturing documentation.
• Analyse existing PCB layouts and simulation results to identify SI/EMC or thermal issues, determine root causes, and define measurable acceptance criteria.
• Redesign PCB layouts to resolve identified issues while preserving the original schematic, netlist connectivity, and component selection.
• Simulate and assess relevant design factors, including impedance, reflections, crosstalk, return paths, temperature distribution, heat dissipation, and hotspots.
• Document design decisions, corrective actions, simulation results, and verification findings; support prototype bring-up, debugging, and validation.

Required Skills

• 6+ years of hands-on electronics hardware and PCB design experience, including multilayer layouts and KiCad.
• Strong circuit analysis, component selection, datasheet interpretation, grounding, power distribution, signal integrity, thermal management, and DFM/DFT knowledge.
• At least 4 years of practical experience in SI/EMC simulation, thermal simulation, or both, including setup, execution, and interpretation.
• Ability to correlate simulation results with PCB layout characteristics and assess model inputs, boundary conditions, material properties, and limitations.
• Experience with relevant tools such as Ansys SIwave, HFSS, Cadence Sigrity, Keysight ADS, Ansys Icepak, FloTHERM, COMSOL Multiphysics, OpenFOAM, or equivalent.

Project Details:

• Contract Start Date: Expected to start as soon as possible
• Engagement: ~13 weeks (with potential chances of extension)
• Commitment - 40 hours/week
• Engagement Type: Contract
• Selection process: 1 AI Interview and 1 Interview with our team